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Ultrasonic Flip Chip Bonder Product List

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Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

Ultrasonic flip chip bonder

A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
  • Ultrasonic Flip Chip Bonder

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